| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer wiring board, wherein fine wiring can be formed and high-reliability inter-layer connections can be made. SOLUTION: The multilayer wiring board includes: a first wiring layer 2 including a first insulating layer 12 and first wiring 32 disposed on one principal surface of the first insulating layer 12 and made of a sintered body of first conductivity paste; and a second wiring layer 4 including a second insulating layer 14, second wiring 34 disposed on one principal surface of the second insulating layer 14 and made of a sintered body of first conductivity paste, a first adhesive layer 24 provided on the other principal surface of the second insulating layer 14 in contact with the one principal surface of the first insulating layer 12, and a first via conductor 44 provided penetrating the second insulating layer 14 and first adhesive layer 24 at a predetermined position, connecting the first wiring 32 and second wiring 34 to each other, and made of a sintered body of second conductivity paste different from the first conductivity paste. COPYRIGHT: (C)2011,JPO&INPIT |
