| 摘要 |
PURPOSE: A module for regulating pressure and wafer polishing assembly having the same are provided to improve the evenness of a wafer by solving pressure unbalance which is generated in the edge of a wafer. CONSTITUTION: In a module for regulating pressure and wafer polishing assembly having the same, a lifting unit(110) is hung on one end of the bottom of a head and lifts it. A plurality of air pressure lines(120) are connected to the lifting unit and supply the air pressure to the lifting unit. A controller(130) receives an electrical signal of setting the height of the lifting unit. A direction control electric valve opens and closes the plural air pressure lines based on an electrical signal from the controller. A regulator receives the electrical signal from the controller and controls the volume of the air pressure. |
