| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem, wherein a wafer is damaged and the enhancement in the sensitivity is obstructed, when the quantity of illumination light is increased in order to detect a fine flaw, while the scattering light due to flaws can be excluded, and the fine flaw can be detected with high sensitivity, when detection range is spatially reduced and that an inspection time is increased by reducing the detection range. SOLUTION: The inspection device includes a feed system for moving a sample; an irradiation optical system for irradiating the sample with linear illumination light; a height detection system for measuring the height of the sample; a detection optical system equipped with a detector having a plurality of pixels; and a processing part for inspecting foreign substances or flaws of the sample, by using the detection result of the detection optical system and a control part for controlling the height of the sample. The control part uses the measured result of the height detection system to control the height of the sample so that the quantity of variation of the linear illumination light is smaller than the size of the pixels. COPYRIGHT: (C)2011,JPO&INPIT
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