发明名称 |
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH LEAD INTERLOCKING MECHANISMS AND METHOD OF MANUFACTURE THEREOF |
摘要 |
A method of manufacture of an integrated circuit packaging system includes: forming a lead having an upper portion and a bottom portion with a first overhang portion from a top surface of the upper portion and the lead also having serrations along upper vertical sides intersecting the top surface; forming an upper contact plate on the top surface; forming a bottom contact plate on a bottom surface of the bottom portion; attaching an integrated circuit die over the upper portion; and encapsulating the upper portion and the integrated circuit die with an encapsulation leaving the bottom portion exposed.
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申请公布号 |
US2011169151(A1) |
申请公布日期 |
2011.07.14 |
申请号 |
US20100961494 |
申请日期 |
2010.12.06 |
申请人 |
CAMACHO ZIGMUND RAMIREZ;BATHAN HENRY DESCALZO;ESPIRITU EMMANUEL |
发明人 |
CAMACHO ZIGMUND RAMIREZ;BATHAN HENRY DESCALZO;ESPIRITU EMMANUEL |
分类号 |
H01L23/495;H01L21/56 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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