METHOD OF MANUFACTURING MULTILAYER WIRING SUBSTRATE, AND MULTILAYER WIRING SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayer wiring substrate by which surface roughness of an outermost layer can be set to a suitable state.

SOLUTION: In a build-up step, a wiring laminate portion 30 is formed by alternately laminating a plurality of resin insulating layers 21 to 24 and a plurality of conductor layers 26 in multilayer arrangement on a base 52 having copper foils 55 and 56 separably laminated and arranged on one surface. In a drilling step, a plurality of openings 35 and 36 are formed in the resin insulating layer 24 as the outermost layer through laser hole processing to expose respective connection terminals 41 and 42. Smears in the openings 35 and 36 are removed thereafter through a desmear step.

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