发明名称 |
Wireless ic device and component for wireless ic device |
摘要 |
A wireless IC device that reduces cost for manufacturing a package, that can be attached to a small article, and that suppresses the thickness of a tag forming portion is formed. For example, a cutout portion (61) having no aluminum-deposited film is formed at an end of an article package (60) made of an aluminum-deposited laminated film, and an electromagnetic coupling module (1) is provided at that portion. The electromagnetic coupling module (1) and the aluminum-deposited film of the package (60) constitute a wireless IC device. A loop electrode, which is a magnetic field transmission auxiliary radiator of the electromagnetic coupling module (1), is coupled to the aluminum-deposited film of the package (60). Thus, the article package (60) operates as a radiator of an antenna overall. |
申请公布号 |
EP2343779(A1) |
申请公布日期 |
2011.07.13 |
申请号 |
EP20110155422 |
申请日期 |
2008.07.02 |
申请人 |
MURATA MANUFACTURING CO., LTD. |
发明人 |
KATO, NOBURO;IKEMOTO, NOBUO |
分类号 |
H01Q23/00;B65D33/14;G06K19/07;G06K19/077;H01Q1/22;H01Q1/36;H01Q7/00;H04B5/02 |
主分类号 |
H01Q23/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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