发明名称 Wireless ic device and component for wireless ic device
摘要 A wireless IC device that reduces cost for manufacturing a package, that can be attached to a small article, and that suppresses the thickness of a tag forming portion is formed. For example, a cutout portion (61) having no aluminum-deposited film is formed at an end of an article package (60) made of an aluminum-deposited laminated film, and an electromagnetic coupling module (1) is provided at that portion. The electromagnetic coupling module (1) and the aluminum-deposited film of the package (60) constitute a wireless IC device. A loop electrode, which is a magnetic field transmission auxiliary radiator of the electromagnetic coupling module (1), is coupled to the aluminum-deposited film of the package (60). Thus, the article package (60) operates as a radiator of an antenna overall.
申请公布号 EP2343779(A1) 申请公布日期 2011.07.13
申请号 EP20110155422 申请日期 2008.07.02
申请人 MURATA MANUFACTURING CO., LTD. 发明人 KATO, NOBURO;IKEMOTO, NOBUO
分类号 H01Q23/00;B65D33/14;G06K19/07;G06K19/077;H01Q1/22;H01Q1/36;H01Q7/00;H04B5/02 主分类号 H01Q23/00
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