发明名称 |
METAL-CERAMIC SUBSTRATE FOR ELECTRIC CIRCUITS OR MODULES, METHOD FOR PRODUCING ONE SUCH SUBSTRATE AND MODULE COMPRISING ONE SUCH SUBSTRATE |
摘要 |
Onto at least part of the surface of a metal layer (12) of a first type, which faces away from the ceramic layer (11), an insulation layer (14) of a glass-containing material with a thickness of ca. 0.015-0.15 mm is applied. On this insulation layer, at least one metal layer (15) of a second type is applied, having a thickness of 0.015-0.15 mm. An independent claim is included for the production of a substrate. |
申请公布号 |
EP1514459(B1) |
申请公布日期 |
2011.07.13 |
申请号 |
EP20030727202 |
申请日期 |
2003.04.11 |
申请人 |
CURAMIK ELECTRONICS GMBH |
发明人 |
SCHULZ-HARDER, JUERGEN;HABERL, PETER |
分类号 |
H05K3/46;H01L23/12;H01L23/373;H01L25/16;H05K1/03;H05K1/09;H05K3/28 |
主分类号 |
H05K3/46 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|