发明名称 METAL-CERAMIC SUBSTRATE FOR ELECTRIC CIRCUITS OR MODULES, METHOD FOR PRODUCING ONE SUCH SUBSTRATE AND MODULE COMPRISING ONE SUCH SUBSTRATE
摘要 Onto at least part of the surface of a metal layer (12) of a first type, which faces away from the ceramic layer (11), an insulation layer (14) of a glass-containing material with a thickness of ca. 0.015-0.15 mm is applied. On this insulation layer, at least one metal layer (15) of a second type is applied, having a thickness of 0.015-0.15 mm. An independent claim is included for the production of a substrate.
申请公布号 EP1514459(B1) 申请公布日期 2011.07.13
申请号 EP20030727202 申请日期 2003.04.11
申请人 CURAMIK ELECTRONICS GMBH 发明人 SCHULZ-HARDER, JUERGEN;HABERL, PETER
分类号 H05K3/46;H01L23/12;H01L23/373;H01L25/16;H05K1/03;H05K1/09;H05K3/28 主分类号 H05K3/46
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