| 摘要 |
PROBLEM TO BE SOLVED: To provide a vacuum processing apparatus in which substrate chucking operation for fixing a substrate onto a substrate placing surface of a substrate holder can be performed only by reciprocally moving the substrate holder by combination with conveying operation of a substrate conveying mechanism, consequently the constitution of a vacuum processing chamber is simplified and the manufacturing cost is reduced. SOLUTION: In the vacuum processing apparatus 10, a substrate chuck mechanism member 30 is attached to the substrate holder 21 provided in the vacuum processing chamber 12, the substrate chuck mechanism member includes a shaft member 31, first and second coil springs 32 and 35 provided in both ends of the shaft member respectively, and a substrate chuck plate 34 provided in an end of the shaft member, and is attached to the substrate holder by using the substrate chuck plate by elastic energization of the first coil spring. The holding state of the substrate 17 on the substrate holder is changed through expansion and contraction of the first and second coil springs in accordance with the reciprocal movement of the substrate holder. COPYRIGHT: (C)2011,JPO&INPIT |
