| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a component mounting device reducing a mounting time when simultaneously mounting components onto a plurality of substrate respectively carried on a plurality of carrier paths. <P>SOLUTION: A surface mounting machine 100 (the component mounting device) includes the first carrier path 11 that can carry a first substrate 110, the second carrier path 12 that can carry a second substrate 120, a head unit 2 (3) that can mount electronic components onto the first substrate 110 carried on the first carrier path 11 and the second substrate 120 carried on the second carrier path 12, and a main control unit 102 controlling the head unit 2 (3) to mount the electronic components onto the first substrate 110 and the second substrate 120 by regarding the first substrate 110 and the second substrate 120 as one substrate. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
