| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat sink for an LED lamp enhancing the heat conduction efficiency without using a printed board. SOLUTION: A medium, such as a heat radiation paste, is applied to a basic body of a heat sink 1. An LED lamp 2 is installed in an installation area. A fixed part 12 and an area to be extruded 120 extended upward from the fixed part 12 are provided at a comparatively high portion around the installation area. The area to be extruded 120 is firmly pressed and driven obliquely toward the installation area by means of a die to press and deform the fixed part 12, so that the material for the area to be extruded 120 is extruded above the installation area to form an engagement part 121, and mechanical coupling is provided between the LED lamp 2 and the heat sink 1. As a result, the LED lamp 2 is fixed without mounting another printed circuit board, and the LED lamp 2 and the heat sink 1 are coupled together directly and firmly. COPYRIGHT: (C)2011,JPO&INPIT
|
