发明名称 NON-CONTACT IC LABEL
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a non-contact IC label for stably mounting an IC chip on a thermally shrinkable base material, and deteriorating communication function of an IC tag while deforming a label base material when a seal label is peeled from an adhered body by using heat. <P>SOLUTION: The non-contact IC label is provided with: a label base material 1 with an adhesive layer 5 formed thereon to be adhered to an adhered body; and a non-contact IC medium 7 formed in the label base material. The label base material is made of thermally shrinkable materials, and has a notch 2. The non-contact IC medium is configured of an antenna 9 and an IC strap 72. The antenna is provided in contact with the label base material. The IC strap is structured by connecting an IC chip 3 to a lead wire 4 formed on a base film 8 having no heat shrinkability. The antenna and the IC strap are electro-magnetically coupled with each other. <P>COPYRIGHT: (C)2011,JPO&INPIT</p>
申请公布号 JP2011133953(A) 申请公布日期 2011.07.07
申请号 JP20090290448 申请日期 2009.12.22
申请人 TOPPAN PRINTING CO LTD 发明人 FURUICHI KOZUE;OMURA KUNIO
分类号 G06K19/10;G06K19/07;G06K19/077;G09F3/00;G09F3/03 主分类号 G06K19/10
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