发明名称 MOLDING METHOD AND MOLDING BY TRANSFER MOLDING
摘要 PROBLEM TO BE SOLVED: To provide a molding method by transfer molding suppressing deformation of an inserted article, and a molding. SOLUTION: The molding method by the transfer molding for sealing the inserted article 3 in a cavity 5a in a mold 5 by the transfer molding, includes a process of injecting a first resin 1 into the cavity 5a to prevent exposure of the surface of the inserted article 3 in the cavity 5a by covering the surface of the insert article 3 in the cavity 5a; and a process of injecting a second resin 2 with higher viscosity than the first resin 1 when injecting into the cavity 5a after the injection of the first resin. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011131421(A) 申请公布日期 2011.07.07
申请号 JP20090290795 申请日期 2009.12.22
申请人 MITSUBISHI ELECTRIC CORP 发明人 HARA MASAFUMI;MITANI TETSUO;MUKUDA MUNEAKI
分类号 B29C45/02;B29C33/12;B29C45/14;B29C45/16;H01L21/56 主分类号 B29C45/02
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