发明名称 ASSEMBLING DEVICE AND ASSEMBLING METHOD FOR FPD MODULE
摘要 PROBLEM TO BE SOLVED: To provide an assembling device and an assembling method for an FPD (Flat Panel Display) module preventing hardening of another side ACF (Anisotropic Conductive Film) when regularly compression-bonding one ACF even in a case ACFs are stuck to the longitudinal both sides of a TAB (Tape Automated Bonding), respectively. SOLUTION: An FPD module assembling line includes an ACF sticking unit, a compression-bonding head 330, and a TAB side heat shield mechanism 340A. The ACF sticking unit sticks a first ACF layer 3a<SB>1</SB>to longitudinal one side of the TAB 2 and sticks a second ACF layer 3a<SB>2</SB>to the longitudinal the other side of the TAB 2. The compression-bonding head 330 thermocompression-bonds the TAB 2 to a display substrate 1 via the first ACF layer 3a<SB>1</SB>. The TAB side heat shield mechanism 340A protects the second ACF layer 3a<SB>2</SB>on the TAB 2 from the influence of heat when thermocompression-bonding the TAB 2 to the display substrate 1. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011134901(A) 申请公布日期 2011.07.07
申请号 JP20090293180 申请日期 2009.12.24
申请人 HITACHI HIGH-TECHNOLOGIES CORP 发明人 DAIROKU NORIYUKI;ONOSHIRO ATSUSHI;KATO HARUYOSHI;YUDA KUNIO;SUGIZAKI SHINJI;NOMOTO HIDEKI
分类号 H01L21/60;G09F9/00;H01L21/603;H05K3/32 主分类号 H01L21/60
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