发明名称 |
ASSEMBLING DEVICE AND ASSEMBLING METHOD FOR FPD MODULE |
摘要 |
PROBLEM TO BE SOLVED: To provide an assembling device and an assembling method for an FPD (Flat Panel Display) module preventing hardening of another side ACF (Anisotropic Conductive Film) when regularly compression-bonding one ACF even in a case ACFs are stuck to the longitudinal both sides of a TAB (Tape Automated Bonding), respectively. SOLUTION: An FPD module assembling line includes an ACF sticking unit, a compression-bonding head 330, and a TAB side heat shield mechanism 340A. The ACF sticking unit sticks a first ACF layer 3a<SB>1</SB>to longitudinal one side of the TAB 2 and sticks a second ACF layer 3a<SB>2</SB>to the longitudinal the other side of the TAB 2. The compression-bonding head 330 thermocompression-bonds the TAB 2 to a display substrate 1 via the first ACF layer 3a<SB>1</SB>. The TAB side heat shield mechanism 340A protects the second ACF layer 3a<SB>2</SB>on the TAB 2 from the influence of heat when thermocompression-bonding the TAB 2 to the display substrate 1. COPYRIGHT: (C)2011,JPO&INPIT
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申请公布号 |
JP2011134901(A) |
申请公布日期 |
2011.07.07 |
申请号 |
JP20090293180 |
申请日期 |
2009.12.24 |
申请人 |
HITACHI HIGH-TECHNOLOGIES CORP |
发明人 |
DAIROKU NORIYUKI;ONOSHIRO ATSUSHI;KATO HARUYOSHI;YUDA KUNIO;SUGIZAKI SHINJI;NOMOTO HIDEKI |
分类号 |
H01L21/60;G09F9/00;H01L21/603;H05K3/32 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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