A PACKAGE SUBSTRATE AND A METHOD OF FABRICATING THE SAME

摘要

PURPOSE: A package substrate and a manufacturing method thereof are provided to minimize stress of a chip in a build-up process. CONSTITUTION: A mold unit(112) is formed to surround a chip(111). A base part(110) includes a connection portion for connecting a chip formed within the mold unit with a terminal portion formed at an outer surface of the mold unit. A build-up layer(120) includes a lateral surface of a base unit. The build-up layer is formed on one surface of the base part having the terminal part. The build-up layer includes a circuit layer which is connected to the terminal portion.