发明名称 Method and apparatus for estimating resistance and capacitance of metal interconnects
摘要 Techniques for estimating resistance and capacitance of metal interconnects are described. An apparatus may include an interconnect, a set of pads, a set of isolation circuits, and a test circuit. The set of pads may be coupled to the interconnect and used for simultaneously applying a current through the interconnect and measuring a voltage across the interconnect. The current and voltage may be used to estimate the resistance of the interconnect. The test circuit may charge and discharge the interconnect to estimate the capacitance of the interconnect. The isolation circuits may isolate the pads from the interconnect when the test circuit charges and discharges the interconnect. The apparatus may further include another interconnect, another set of pads, and another set of isolation circuits that may be coupled in a mirror manner. Resistance and/or capacitance mismatch between the two interconnects may be accurately estimated.
申请公布号 US7973541(B2) 申请公布日期 2011.07.05
申请号 US20070951491 申请日期 2007.12.06
申请人 QUALCOMM INCORPORATED 发明人 JAYAPALAN JAYAKANNAN;BANG DAVID;DU YANG
分类号 G01R27/26 主分类号 G01R27/26
代理机构 代理人
主权项
地址