发明名称 Semiconductor device
摘要 A gate electrode 20 and first field plates 22a to 22d and 23 are provided on a field oxide film 19. The gate electrode 20 and first field plates 22a to 22d and 23 are covered with an insulating film 24. A high-voltage wiring conductor 28 is provided on the insulating film 24. A shielding electrode 29 is provided between the first field plate 22a positioned closest to a source side and the high-voltage wiring conductor 28.
申请公布号 US7973382(B2) 申请公布日期 2011.07.05
申请号 US20070782390 申请日期 2007.07.24
申请人 MITSUBISHI ELECTRIC CORPORATION 发明人 TAKAHASHI TETSUO
分类号 H01L23/58 主分类号 H01L23/58
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