发明名称 |
Molded Article for Electronic Device Housing and Method for Preparing the Same |
摘要 |
A molded article for an electronic device housing having a thickness of about 0.2 to about 2 mm and an apparent specific gravity of about 0.8 to about 2.5 g/ml is provided. A method for preparing the molded article for an electronic device housing includes extrusion molding a thermoplastic resin composition to form a continuous profile extrudate with a prescribed cross-sectional shape; and vacuum forming the continuous profile extrudate to form a molded article with a thickness of about 0.2 to about 2 mm and an apparent specific gravity of about 0.8 to about 2.5 g/ml.
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申请公布号 |
US2011159259(A1) |
申请公布日期 |
2011.06.30 |
申请号 |
US20100980685 |
申请日期 |
2010.12.29 |
申请人 |
CHEIL INDUSTRIES INC. |
发明人 |
PARK JEE KWON;CHOI JIN HWAN;PARK KANG YEOL;KIM JUN MYUNG;LEE JAE WON;LIM YOON SOOK |
分类号 |
B32B7/02;B29C51/36;B32B27/00;B32B27/30;B32B27/32;B32B27/36 |
主分类号 |
B32B7/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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