发明名称 |
DUPLEXER DEVICE AND METHOD OF MANUFACTURING THE SAME |
摘要 |
There is provided a duplexer device and a method of manufacturing the same. The duplexer device includes a substrate including a duplex circuit; first and second acoustic wave filter chips mounted on the substrate in a flip chip bonding manner and constituting an Rx (receiver) filter and a Tx (transmitter) filter, respectively; and a molding portion covering the first and second acoustic wave filter chips. The first and second acoustic wave filter chips are arranged by flip chip bonding, so there is no need for a separate protective structure so as to protect device functional portions of the chips. Accordingly, a compact product is realized and a manufacturing process is simplified.
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申请公布号 |
US2011156836(A1) |
申请公布日期 |
2011.06.30 |
申请号 |
US20100843394 |
申请日期 |
2010.07.26 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
LEE YEONG GYU;YE YONG DEUK;KYOUNG JE HONG;JUN CHAN BONG |
分类号 |
H03H9/72 |
主分类号 |
H03H9/72 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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