| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a wiring board increasing the wiring density of a lower wiring layer under a connection pad. <P>SOLUTION: The board includes a wiring layer 22, an insulating layer 32 formed on the wiring layer 22, the connection pad C formed on the insulating layer 32, and a via conductor VC2 formed through the insulating layer 32 to connect the wiring layer 22 with the connection pad C. The wiring layer 22 located one layer below the connection pad C is formed by including via-receiving electrode parts 22a, 22c (22x) of an area smaller than that of the connection pad C and a wiring part 22b (22y) separated from it in a region corresponding to the connection pad C, and the via-receiving electrode parts 22a, 22c (22x) are connected with the connection pad C via the via conductor VC2. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
