发明名称 PRINTED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a printed wiring board capable of reducing cost. SOLUTION: This printed wiring board 1 includes an insulating board 10, wires 20 laminated on the insulating board 10 and formed of copper, and a coverlay film 50 covering the wires 20, wherein each wire 20 includes a terminal part 21 exposed from the coverlay film 50. The printed wiring board further includes first coating layers 30 formed by hardening silver paste and covering the terminal parts 21, and second coating layers 40 formed by hardening carbon paste and covering all surfaces of the first coating layers 30. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011129772(A) 申请公布日期 2011.06.30
申请号 JP20090288061 申请日期 2009.12.18
申请人 FUJIKURA LTD 发明人 OHARA NAOTO
分类号 H05K1/09;H05K1/11;H05K3/24 主分类号 H05K1/09
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