发明名称 BGA FOOTPRINT PATTERN FOR INCREASING NUMBER OF ROUTING CHANNELS PER PCB LAYER
摘要 A printed circuit board (PCB) includes a ball grid array (BGA). The PCB further includes a first BGA pad having a circular shape, and a first via having a circular shape, where the circular shape of the first via overlaps a portion of the circular shape of the first BGA pad and is rotated diagonally relative to a center of the first BGA pad. The PCB also includes a second BGA pad having a circular shape, and a second via having a circular shape, where the circular shape of the second via overlaps a portion of the circular shape of the second BGA pad and is rotated diagonally relative to a center of the second pad, and where a center of the second via is located at a first distance from the center of the first via and at a first angle relative to an axis that crosses a center of the first via.
申请公布号 US2011155434(A1) 申请公布日期 2011.06.30
申请号 US20090647737 申请日期 2009.12.28
申请人 JUNIPER NETWORKS INC. 发明人 REYNOV BORIS;YUE PING;SIDDHAYE SHREERAM;CLEVELAND JOHN;SRINIVAS CHEBROLU;VENKATARAMAN SRINIVAS
分类号 H05K1/11 主分类号 H05K1/11
代理机构 代理人
主权项
地址