发明名称 |
TEST KIT FOR TESTING A CHIP SUBASSEMBLY AND A TESTING METHOD BY USING THE SAME |
摘要 |
A test kit for testing a chip subassembly and a testing method by using the same is provided. The chip subassembly includes at least two stacked chips each having a number of electric contacts is provided. The test kit includes a test socket and a test plate. The test socket is configured to electrically engage the electric contacts on a first side of the chip subassembly. The test plate has at least a number of first probes configured for electrically engaging the electric contacts on a second side of the chip subassembly. At least one of the test socket and the test plate has a number of second probes for electrically connecting the test socket and the test plate.
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申请公布号 |
US2011156739(A1) |
申请公布日期 |
2011.06.30 |
申请号 |
US20090651067 |
申请日期 |
2009.12.31 |
申请人 |
CHANG HSIAO-CHUAN;CHENG MING-HSIANG;TSAI TSUNG-YUEH;LAI YI-SHAO;CHEN MING-KUN |
发明人 |
CHANG HSIAO-CHUAN;CHENG MING-HSIANG;TSAI TSUNG-YUEH;LAI YI-SHAO;CHEN MING-KUN |
分类号 |
G01R31/02;G01R1/06;G01R31/26 |
主分类号 |
G01R31/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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