| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an LED package that increases capacity for removing heat of a metal lead. <P>SOLUTION: A die package 10 includes a substrate 20, a reflector plate 40, and a lens 50. The substrate is made from thermally conductive but electrically insulating material. The substrate has a plurality of traces for connecting an external electrical power source to a light emitting diode (LED) at a mounting pad. The reflector plate is coupled with the substrate and substantially surrounds the mounting pad. The lens is free to move relative to the reflector plate and is capable of being raised or lowered by the encapsulant which wets and adheres to it and is placed at an optimal distance from the LED chips. The lens can be coated with any optical system of chemical which affects the performance of the device. Heat generated by the LED during operation is drawn away from the LED by both the substrate (acting as a bottom heat sink) and the reflector plate (acting as a top heat sink). <P>COPYRIGHT: (C)2011,JPO&INPIT |
