| 摘要 |
PROBLEM TO BE SOLVED: To provide a processing method of an optical device wafer which can be formed into a desired thickness without being bent. SOLUTION: The processing method of the optical device wafer forms, into a desired thickness, the optical device wafer in which an optical device layer is laminated on the surface of a substrate, and a plurality of optical devices are formed. The method also includes a protective member sticking process which makes a protective member stick to the surface of the optical device wafer, a grinding process which grinds the rear surface of the optical device wafer into the desired thickness while holding the protective member side of the optical device wafer to which the protective member is stuck on a chuck table, and a polishing process which polishes the rear surface of the optical device wafer to which the grinding process is applied where the polishing process finishes the rear surface to be flat, making slight grinding distortion generated in the rear surface of the substrate of the optical device wafer in the grinding process remain slightly. COPYRIGHT: (C)2011,JPO&INPIT |
