发明名称 |
Flip chip package containing novel underfill materials |
摘要 |
Methods and associated structures of forming underfill material are described. Those methods may include applying an underfill to an interconnect structure comprising residue from a no clean flux, wherein the underfill comprises at least one of a functionalized nanofiller and a micron-sized filler.
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申请公布号 |
US2011159228(A1) |
申请公布日期 |
2011.06.30 |
申请号 |
US20090655366 |
申请日期 |
2009.12.29 |
申请人 |
SWAMINATHAN RAJASEKARAN;DONG HONG;RAZDAN SANDEEP;ANANTHAKRISHANA NISHA;MANEPALLI RAHUL |
发明人 |
SWAMINATHAN RAJASEKARAN;DONG HONG;RAZDAN SANDEEP;ANANTHAKRISHANA NISHA;MANEPALLI RAHUL |
分类号 |
B32B5/16;B05D5/00;C08L63/00 |
主分类号 |
B32B5/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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