发明名称 WAFER-TO-WAFER STACK WITH SUPPORTING PEDESTAL
摘要 An electronic device having a stacked structure is provided. The electronic device includes a first electronic layer, a second electronic layer disposed on the first electronic layer, and at least a post. The first electronic layer has a first interface, and including a first substrate and a first device layer disposed on the first substrate. The first interface is located between the first substrate and the first device layer, and the first device layer has a surface opposite to the first interface. The post is arranged in the first device layer, and extending from the first interface to the surface of the first device layer.
申请公布号 US2011156249(A1) 申请公布日期 2011.06.30
申请号 US20100982046 申请日期 2010.12.30
申请人 INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE 发明人 CHANG CHI-SHIH;TAIN RA-MIN;LIAU SHYI-CHING;LO WEI-CHUNG;LEE RONG-SHEN
分类号 H01L23/48 主分类号 H01L23/48
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