EPOXY RESIN COMPOSITION, PROCESS FOR PRODUCTION OF ASSEMBLY USING SAME, AND ASSEMBLY

摘要

Provided is an epoxy resin composition which ensures excellent connection reliability and exhibits excellent transparency. Also provided are both a process for the production of an assembly using the same and an assembly. The process comprises: an application step of applying an epoxy resin composition (2) in the form of a sheet to a printed board (1), said epoxy resin composition (2) comprising a phenolic novolak-based curing agent, an acrylic elastomer consisting of a copolymer that comprises dimethylacrylamide and hydroxyethyl methacrylate, an epoxy resin, and an inorganic filler in an amount of 5 parts by mass or more but less than 20parts by mass per 100 parts by mass of the epoxy resin; a temporary mounting step of mounting a semiconductor chip (3) and condensers (4a) to (4d) temporarily on the epoxy resin composition (2); and a proper thermocompression bonding step of pressing the semiconductor chip (3) and the condensers (4a) to (4d) with a thermocompression head (20) to conduct proper thermocompression bonding of the semiconductor chip (3) and the condensers (4a) to (4d).