| 摘要 |
A semiconductor package substrate structure includes a circuit board with a plurality of first electrically connecting pads formed on at least a surface of the circuit board, conductive posts formed on the first electrically connecting pads, and an insulative protection layer formed on the surface of the circuit board and formed with openings for completely exposing the conductive posts. The conductive posts protrude from the substrate, thereby facilitating the electrical connection between the conductive posts and a semiconductor chip, and enhancing the quality and reliability of a subsequent packaging process. |
