Process and device for separating a part of material along a predetermined separating line using a cutting beam

摘要

The method involves moving cutting beam (11) e.g. fluid jet or laser beam during cutting process such that cutting beam impinges on a material layer (20) laterally offset by a distance (W) from the cutting line (21). The distance is determined as a function of the variations of the cutting speed at which the cutting beam is moved and the deviations of the effective cross-section of the cutting beam from a circular shape. An independent claim is included for cutting device.