发明名称 |
EPOXY RESIN FORMULATIONS FOR UNDERFILL APPLICATIONS |
摘要 |
EPDXY RESIN FORMULATIONS FOR UNDERFILL APPLICATIONS Disclosed is a low viscosity, low to no chloride containing epoxy resin formulation including a divinylbenzene dioxide as a component in the formulation; wherein the formulation is useful for the manufacture of capillary underfill compositions. |
申请公布号 |
SG171555(A1) |
申请公布日期 |
2011.06.29 |
申请号 |
SG20100085579 |
申请日期 |
2010.11.22 |
申请人 |
DOW GLOBAL TECHNOLOGIES INC. |
发明人 |
WILSON MARK B.;POTISEK STEPHANIE L. |
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