| 摘要 |
PURPOSE: A light emitting device package and a manufacturing method thereof are provided to reduce manufacturing costs by integrating a ceramic layer for a varistor with a substrate of a multilayered structure. CONSTITUTION: A substrate(10) includes an electrode pattern(15) and an internal electrode connected to the electrode pattern. A light emitting device(20) is electrically connected to the electrode pattern. A mold unit(30) is formed on the substrate to seal the light emitting device. A varistor unit(40) is formed on the substrate. Tungsten films(42,43) are formed on both sides of the varistor.
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