APPARATUS AND METHOD FOR SUPPLYING WAFER POLISHING SLURRY

摘要

PURPOSE: An apparatus and method for supplying wafer polishing slurry is provided to prevent the change of the composition component of the polishing slurry by a cohesion or a volatilization of a polishing particles. CONSTITUTION: An apparatus for supplying wafer polishing slurry comprises: a supply quantity regulating unit(110), a raw material mixing unit(120), and a buffer tank(130). The supply quantity regulating unit keeps the supply quantity of the polishing slurry raw material to be more than two. The flow direction of the polishing slurry raw material provided from the supply quantity regulating unit is converted over one process and the flow path is formed inside the raw material mixing unit. The raw material mixing unit mixes the polishing slurry raw material through the flow path and creates the polishing slurry. The buffer tank provides the polishing slurry from the raw material mixing unit and supplies the slurry to the polishing machine.