发明名称 HEAT CURABLE ADHESIVE COMPOSITION
摘要 1) Heat-curable adhesive composition comprising: from 20 to 85% of a polyether (A) comprising 2 hydrolysable alkoxysilane-type end groups, having a viscosity, measured at 23° C., ranging from 25 to 40 Pa·s and of formula (I): in which: R1 and R2 represent an alkyl radical having 1 to 4 carbon atoms; R3 represents a linear alkylene radical having 1 to 6 carbon atoms; R4 represents an alkylene radical having 1 to 4 carbon atoms; n is an integer such that the number-average molecular weight Mn of the polymer of formula (I) is between 20 kDa and 40 kDa; p is an integer equal to 0, 1 or 2; from 15 to 80% of a compatible tackifying resin (B); and from 0.01 to 3% of a curing catalyst (C). 2) Self-adhesive support coated with the cured adhesive composition. 3) Use for the manufacture of self-adhesive labels and/or tapes.
申请公布号 US2011151253(A1) 申请公布日期 2011.06.23
申请号 US20100973044 申请日期 2010.12.20
申请人 BOSTIK S.A. 发明人 LAFERTE OLIVIER;GOUBARD DAVID
分类号 C08L83/00;B32B7/12;C08L57/02 主分类号 C08L83/00
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