METHOD FOR BONDING FPC ONTO BASEBOARD, BONDING ASSEMBLY, AND TOUCH SCREEN

摘要

A method for bonding a flexible printed circuit (FPC) onto a baseboard is provided. The baseboard includes a bonding region having a plurality of first electrodes, and a protective layer covering the bonding region. The FPC includes a plurality of second electrodes. The method includes aligning the FPC with the bonding region of the baseboard, positioning an ACF between the FPC and the baseboard, and pressing the FPC towards the baseboard such that an end of a conductive particle abuts against the second electrode of the FPC, and an opposite end of the conductive particle penetrates the protective layer and contacts the first electrodes.