METHOD OF MANUFACTURING LIGHT-EMITTING DEVICE

摘要

PROBLEM TO BE SOLVED: To enable coating between a light-emitting element subjected to flip-chip packaging and a support to prevent a sealing member covering the light-emitting element from entering more than necessary by a simpler method.

SOLUTION: The method of manufacturing a light-emitting device includes a first process of applying the sealing member along a side face of the light-emitting element while including the rectangular light-emitting element subjected to flip-chip packaging to the support and the sealing member covering the light-emitting element and a second process of applying the sealing member from an upper surface of the light-emitting element.

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