发明名称 |
HEAT DISSIPATION DEVICE AND ELECTRONIC SYSTEM INCORPORATING THE SAME |
摘要 |
A heat dissipation device for a first electronic component and a second electronic component mounted on a circuit board includes a first base mounted on the first electronic component and a second base mounted on the second electronic component. The second base is movably connected with the first base. An electronic system incorporating the heat dissipation device is also provided.
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申请公布号 |
US2011149515(A1) |
申请公布日期 |
2011.06.23 |
申请号 |
US20100770749 |
申请日期 |
2010.04.30 |
申请人 |
FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD.;FOXCONN TECHNOLOGY CO., LTD. |
发明人 |
YANG JIAN |
分类号 |
H05K7/20;H05K7/00 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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