| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To sustain a crushed distance of solder bumps within a range of the set distance. <P>SOLUTION: A timing when a solder bump 30 hits and contacts a substrate 14 is detected by lowering a pressure block 5 together with a mounting head 6, a gap corresponding to the crushed distance Ls is formed between a mechanical stopper 9 and a pressure block 6 by lowering only the mounting head 6 by the crushed distance Ls, and a reading of a position sensor 10 is stored in a register R1 by stopping the mounting head 6. An over-travel problem of the crushed distance having come along with thermal expansions of the pressure block 5 and an electronic component grip heating means 4 is solved by sequentially obtaining the current value L of the reading of the position sensor 10 while the electronic components 3 are pressed into the substrate 14 by lowering the pressure block 5 with the mounting head 6 stopped, and by drive-controlling a mounting head moving mechanism 13 in a moving upward direction of the mounting head 6 so that the current value L is not greater than the current value of the reading stored in the register R1 of a RAM 17. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
