METHOD FOR IMPARTING EMBOSSED SHAPES TO ACRYLIC RESIN FILM

摘要

Disclosed is a method for imparting embossed shapes to an acrylic resin film using an embossing die at a temperature (T°C) within the range of TD+25°C = T = TD+50°C (wherein TD is the heat distortion temperature of the acrylic resin film), the method being characterized in that the storage modulus (E') of the acrylic resin film when subjected to a measurement frequency of 0.1 Hz at the aforementioned temperature (T°C) is from 0.20 to 0.36 MPa, and the elongation at break is at least 100% when evaluated by performing a tensile test at 23°C with an initial chuck-to-chuck distance of 50 mm and at a tensile speed of 500 mm/minute using a 50-µm-thick, 15-mm-wide film-form test specimen. Thus, the method achieves excellent embossed shape-imparting characteristics, film-handling characteristics, and die-release characteristics.