发明名称 INSULATING SHEET, LAMINATED STRUCTURE, AND MANUFACTURING METHOD OF LAMINATED STRUCTURE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide an insulating sheet and a laminated structure high in handleability at a non-cured state, capable of obtaining a cured object with high heat resistance and capable of restraining a warp of a laminated object laminated on the cured object. <P>SOLUTION: The insulating sheet contains a polymer with a diphenylene sulfone group, a curing compound with an epoxy group or an oxetane group, a curing agent and a filler. The laminated structure 1 is provided with a substrate 2 having a first conductive layer 2b at least on one of its faces and either a through-hole or a concave part on one of the faces, insulating layers 3, 4 laminated on one or both faces of the substrate 2, and second conductive layers 5, 8 laminated on a face opposite to the face of the substrate 2 laminated with the insulating layers 3, 4 or a circuit board. The insulating layers 3, 4 are formed by curing the insulating sheet. <P>COPYRIGHT: (C)2011,JPO&INPIT</p>
申请公布号 JP2011124077(A) 申请公布日期 2011.06.23
申请号 JP20090280331 申请日期 2009.12.10
申请人 SEKISUI CHEM CO LTD 发明人 TAKAHASHI RYOSUKE;MAENAKA HIROSHI;AOYAMA TAKUJI;KUSAKA YASUNARI;INOUE TAKANORI;KONDO SHUNSUKE;YAMADA YU;WATANABE TAKASHI
分类号 H01B17/56;C08G59/42;C08G59/62;C08K5/09;C08K9/04;C08L61/00;C08L63/00;C08L81/06;H01B19/00;H01L23/12;H05K1/03;H05K3/46 主分类号 H01B17/56
代理机构 代理人
主权项
地址