| 摘要 |
PURPOSE: A semiconductor package and a method for manufacturing the same are provided to improve electrical connection reliability between the semiconductor package and an external device by controlling the thickness of the external device based on the thickness of a conductive layer. CONSTITUTION: A semiconductor chip is flip-chip bonded to a rearranged wiring layer(120). A sealing material(150) hermetically seals the semiconductor chip. A connection unit(161) is arranged on the rearranged wiring layer. A solder ball(162) is arranged on the connection unit. The connection unit is a metal post with a thickness range of 100 to 500um.
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