| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve the problem: balls corresponding to inclination of a work head plate are intervened, a gimbal point becomes high, a pressure applied downward to the work head plate is hardly averaged, stabilization is not achieved because a wafer cannot follow subtle inclination of a polishing head in the outer periphery, resulting in a factor of flyout of the wafer in lifting up the polishing head. <P>SOLUTION: The polishing head includes: a spindle shaft 1; a head holding member 3 integrally having a cylindrical upper portion 3a and a cup-like lower portion 3b; an outer spherical bearing 4; a plurality of drive pins 5; an inner spherical bearing 6; a head body 7 on which a plurality of drive pin inserting holes 7b for inserting the drive pins 5 are engraved; a circular airbag 8; a flexible film 10; and a connecting bolt 11. A gimbal point P formed by the outer spherical surface bearing 4 and the inner spherical bearing 6 is matched with the lower surface of the flexible film 10. <P>COPYRIGHT: (C)2011,JPO&INPIT |
