发明名称 POLYGLYCOL ACID RESIN COMPOSITION AND MOLDED BODY THEREOF
摘要 <p>To provide polyglycolic acid resin compositions having excellent moldability, and high barrier properties and transparency after molding, and molded articles therefrom. According to the present invention, a polylactic acid having a mass average molecular weight Mw of 100000 to 1000000 is added to a polyglycolic acid having a mass average molecular weight Mw of 100000 to 1000000 in a content of the polylactic acid of 5 to 30% by mass, and the mixture is melt-kneaded under, for example, a temperature condition of 230 to 2705°C, thereby obtaining a resin composition having a temperature-lowering crystallization peak temperature Tc, measured by differential scanning calorimetry, of 3 to 18°C lower than that of a polyglycolic acid only.</p>
申请公布号 EP2336244(A1) 申请公布日期 2011.06.22
申请号 EP20090817574 申请日期 2009.07.27
申请人 KUREHA CORPORATION 发明人 ITOH DAISUKE;TOHMIYA NAOKO
分类号 C08L67/04;C08J5/00;C08L101/16 主分类号 C08L67/04
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