| 摘要 |
A socket terminal heat-dissipating mechanism is provided for use in an electronic device. The electronic device includes a frame and a casing. The socket terminal heat-dissipating mechanism includes a socket and an insulating layer. The socket is mounted in the frame of the electronic device, and includes a contact terminal. The insulating layer is arranged between the contact terminal and the casing of the electronic device, wherein heat energy is conducted from the contact terminal of the socket to the casing through the insulating layer, and passively dissipated away.
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