| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an IC tray material which while having low water absorbency, achieves a sufficiently high molecular weight, has a wide moldable temperature range calculated from the difference between the melting point and the thermal decomposition temperature thereof, has excellent melt moldability and excellent electrical conductivity, and is more excellent in heat resistance, chemical resistance, hydrolysis resistance and the like as compared with conventional aliphatic polyamide resins. <P>SOLUTION: The IC tray material contains an electrical conductivity-imparting agent in a polyamide resin wherein the dicarboxylic acid component is composed of oxalic acid and the diamine component is composed of 1,9-nonanediamine and 2-methyl-1,8-octanediamine. The molar ratio between 1,9-nonanediamine and 2-methyl-1,8-octanediamine is from 1:99 to 99:1. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
