| 摘要 |
PROBLEM TO BE SOLVED: To provide a heating condition determination method that allows efficient production by a reflow device configured to heat substrates of different kinds. SOLUTION: The method for determining heating conditions of the reflow device used for a mounting line for producing the substrates of different kinds, includes a first search step (S11) of searching for a first temperature setting meeting temperature profile conditions of all of the substrates of different kind by simulating a temperature profile of a virtual substrate having maximum and minimum thermal characteristic values of the substrates of different kinds when the virtual substrate is carried at a first carrying speed, and a heating condition determination step (S17) of determining heating conditions including carrying of the substrates of different kinds at the first carrying speed with the first temperature setting. COPYRIGHT: (C)2011,JPO&INPIT |
