| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a light-emitting device capable of dissipating heat generated in a semiconductor light-emitting element and/or a resin layer, not only right below the light-emitting element, but also at a remote position in a main-plane direction. <P>SOLUTION: The light-emitting element is mounted on a substrate and covered with a resin. On the substrate, an anisotropic thermally-conductive material is mounted which has larger thermal conductivity in the main plane direction of the substrate than in a thickness direction. A side face of the anisotropic thermally-conductive material is in contact with the resin. Consequently, the anisotropic thermally-conductive material receives the heat from the resin and conducts the heat in the main-plane direction to dissipate heat at a position apart from the light-emitting element and/or resin. For example, a stack of one or more layers of sheet type graphite is used as the anisotropic thermally-conductive material. <P>COPYRIGHT: (C)2011,JPO&INPIT |
