发明名称 CUTTING DEVICE AND CUTTING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a cutting device and a cutting method for restraining the occurrence of a burr and separation of resin when cutting a work. SOLUTION: This cutting device cuts the work having a lead frame mounted with a plurality of LED chips, a first resin molded on the lead frame so as to surround the LED chips and a second resin having a property softer than the first resin and sealing the LED chips, and includes a holding part for sucking and holding the work and a cutting blade for cutting the work and held by the holding part. The holding part includes a suction part for vacuum-sucking the work from the second resin side and a cooling part for cooling the second resin. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011115875(A) 申请公布日期 2011.06.16
申请号 JP20090274185 申请日期 2009.12.02
申请人 APIC YAMADA CORP 发明人 UCHIYAMA SHIGEYUKI
分类号 B24B27/06;B24B41/06 主分类号 B24B27/06
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