发明名称 SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To reduce the size of a semiconductor device having an inertial sensor and ICs (integrated circuits), as well as, reducing the power consumption in the inertial sensor. SOLUTION: The semiconductor device includes a weight, an IC substrate, and an elastic support that supports the weight on the IC substrate. A first electrode is formed on the weight, while a second electrode is formed on the IC substrate. The first and second electrodes constitute a switch having two states of contacting and noncontacting. When the switch is brought to a first state, the motion of a prescribed function part of the IC substrate is put into a first mode; and when the switch is not brought to the first state within a fixed period, the motion of the prescribed function part of the IC substrate is put in a second mode. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011117820(A) 申请公布日期 2011.06.16
申请号 JP20090275217 申请日期 2009.12.03
申请人 SEIKO EPSON CORP 发明人 HISAMATSU HIROKAZU
分类号 G01P15/135;H01H35/14;H01L29/84 主分类号 G01P15/135
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