发明名称 LASER MACHINING DEVICE AND METHOD USING THE SAME
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a laser machining device, which splits a laser beam output from a single laser oscillator into two different wavelengths, or a fundamental wavelength and a harmonic wavelength, and achieves machining using these two laser beams for the same purpose; and also to provide a method using the same. <P>SOLUTION: The laser machining device includes: a laser oscillator 1 which outputs a laser beam; a wavelength converter 3 which receives a laser beam output from the laser oscillator 1 and generates a fundamental wavelength 2 and a harmonic wavelength 4; an optical element 6 for fundamental wavelengths which transmits the fundamental wavelength 2 generated by the wavelength converter 3; an optical element 7 for harmonic wavelengths which transmits the harmonic wavelength 4 generated by the wavelength converter 3; a laser beam synthesizer 10 which receives the fundamental wavelength 2 transmitted from the optical element 6 for fundamental wavelengths and the harmonic wavelength 4 transmitted from the optical element 7 for harmonic wavelengths and synthesizes a laser beam; and a collective lens 11 which irradiates an article to be machined 12 with the laser beam through water synthesized by the laser beam synthesizer 10. <P>COPYRIGHT: (C)2011,JPO&INPIT</p>
申请公布号 JP2011115853(A) 申请公布日期 2011.06.16
申请号 JP20100247602 申请日期 2010.11.04
申请人 TOSHIBA CORP 发明人 SENDA ITARU;MUKAI SHIGEHIKO;UEHARA TAKUYA;HIROTA KEIICHI
分类号 B23K26/36;B23K26/00;B23K26/04;B23K26/067 主分类号 B23K26/36
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