| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring circuit board and a method of manufacturing the same, improving adhesiveness between wiring patterns and an insulation layer. SOLUTION: The wiring circuit board 70 includes the insulation layer 1. A plurality of wiring patterns 7 are formed on the insulation layer 1. Each of the wiring patterns 7 includes an interface layer 2, a first seed layer 3, a second seed layer 4 and a wiring layer 6. The interface layer 2, the first seed layer 3, the second seed layer 4 and the wiring layer 6 are laminated on the insulation layer 1 in this order. The interface layer 2 is formed so that the electrode voltage is not less than -0.3 V and not more than 0.01 V, the electrode voltage being against a saturated calomel electrode in a mixed aqueous solution including sulfuric acid at a concentration of 18% (volume concentration) and hydrochloric acid at a concentration of 10%. COPYRIGHT: (C)2011,JPO&INPIT |
